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HMC704LP4E
v03.1211
8 GHz fractionaL-n PLL
For price, delivery, and to place orders: Hittite Microwave Corporation,20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
outline Drawing
table 4. Package information
Part Number
Package Body Material
Lead Finish
MsL Rating
Package Marking [1]
HMC704LP4E
RoHs-compliant Low stress Injection Molded Plastic
100% matte sn
MsL1[2]
H704
XXXX
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260°C
NOTEs:
[1] PACKAGE BODY MATERIAL: LOW sTREss INJECTION MOLDED PLAsTIC sILICA AND sILICON IMPREGNATED.
[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
[4] DIMENsIONs ARE IN INCHEs [MILLIMETERs].
[5] LEAD sPACING TOLERANCE Is NON-CUMULATIVE.
[6] PAD BURR LENGTH sHALL BE 0.15mm MAX. PAD BURR HEIGHT sHALL BE 0.05mm MAX.
[7] PACKAGE WARP sHALL NOT EXCEED 0.05MM
[8] ALL GROUND LEADs AND GROUND PADDLE MUsT BE sOLDERED TO PCB RF GROUND.
[9] REFER TO HITTITE APPLICATION NOTE FOR sUGGEsTED PCB LAND PATTERN.